Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy
| Authors | |
|---|---|
| Year of publication | 2010 |
| Type | Article in Periodical |
| Magazine / Source | JOURNAL OF ELECTRONIC MATERIALS |
| MU Faculty or unit | |
| Citation | |
| Web | Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy |
| Doi | http://dx.doi.org/10.1007/s11664-009-1070-2 |
| Field | Physical chemistry and theoretical chemistry |
| Keywords | Lead-free soldering; solidification; CALPHAD; DSC simulation |
| Description | The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200A degrees C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach. |
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