Effect of plasma treatment on the surface morphology and wettability of (111) and (100) silicon wafers

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Authors	SKÁCELOVÁ Dana HANIČINEC Martin SŤAHEL Pavel ČERNÁK Mirko
Year of publication	2011
Type	Conference abstract
MU Faculty or unit	Faculty of Science
Citation
Description	This paper is focused on the plasma treatment of silicon surface. The effect of plasma treatment in dependence of the different crystallographic orientation of silicon surface,(100) plane and (111) plane is compare
Related projects:	Study and application of plasma chemical reactions in non-isothermic low temperature plasma and its interaction with solid surface