Interaction of Silver Nanoparticles with Copper Substrate under Air Atmosphere

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Authors

SOPOUŠEK Jiří BURŠÍK Jiří ZÁLEŠÁK Jakub BURŠÍKOVÁ Vilma BROŽ Pavel

Year of publication 2010
Type Article in Proceedings
Conference TechConnect WORLD Conference & Expo 2010
MU Faculty or unit

Faculty of Science

Citation
Web Nanotech 2010 (Anaheim CA)
Field Physical chemistry and theoretical chemistry
Keywords Soldering nanopowder substrate characterisation
Attached files
Description Sintering effect of Ag nanoparticles studied in this work seems to be an interesting alternative of lead-free soldering. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique.
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