Influence of substrate material on plasma indeposition/sputtering reactor: experiment and computer simulation

Investor logo
Investor logo

Warning

This publication doesn't include Faculty of Sports Studies. It includes Faculty of Science. Official publication website can be found on muni.cz.
Authors

BRZOBOHATÝ Oto BURŠÍKOVÁ Vilma NEČAS David VALTR Miroslav TRUNEC David

Year of publication 2008
Type Article in Periodical
Magazine / Source Journal of Physics D: Applied Physics
MU Faculty or unit

Faculty of Science

Citation
Field Plasma physics
Keywords r.f. plasma; computer simulation; secondary electron emision; plasma deposition; plasma sputtering
Description The aim of the present work was to investigate the influence of the substrate material on the plasma enhanced chemical vapor deposition and the plasma sputtering of thin films in low pressure parallel-plate r.f. discharges. It was observed that the deposition or sputtering rates differed above different materials, e.g., above a substrate and substrate electrode. Moreover, the substrates placed on the bottom r.f. electrode seemed to be mirrored in the thickness of a thin film deposited or sputtered on the upper grounded electrode. The influence of the substrate material on the plasma parameters was studied via Particle In Cell/Monte Carlo computer simulation. According to our finding the mirroring of the substrate was caused by different secondary electron emission yields of the substrate material and material of the substrate electrode.
Related projects:

You are running an old browser version. We recommend updating your browser to its latest version.

More info