Nanoparticle synthesis of Bi, Ni, Sn and their alloys potentially applicable as lead-free nanosolders.
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| Year of publication | 2018 |
| Type | Appeared in Conference without Proceedings |
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| Description | Metal nanoparticles and their alloys are promising materials which can be possibly applicable as lead-free solders. Some materials are barely applicable due to their high melting points despite their good mechanical properties. Particles with diameters under 100 nm can display a melting point depression which is caused by surface energy contribution as it is explained in the Gibbs-Thomson equation. This phenomenon is possibly a solution for practical use of solders with high melting points in bulk scale.In our research a synthetic process is optimized to be useful for all the above mentioned metals and alloys with satisfactory results to prepare nanoparticles with diameters below 100 nm featuring melting point depression. Obtained nanoparticles and nanoalloys are characterized by an array of techniques with focusing on describing size distribution and phase transformations. Their phase transformations and thermal behavior are compared with theoretical phase diagrams of bulk and nanomaterials. In cases where nanoparticles display large melting point depression, the materials are considered for possible application as solders. In this work we specifically targeted Bi, Ni and Sn nanoparticles and their binary nanoalloys prepared by reduction synthesis at laboratory temperature. The size distribution of studied nanoparticles and nanoalloys depends on used system and influences the value of melting point depressions. However, for all of mentioned systems, nanoparticles with diameters under 50 nm were obtained. Synthesized nanoparticles were characterized by electron microscopy, powder x-ray diffraction and differential scanning calorimetry. |
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