Novel method of reactive magnetron sputtering process control
| Authors | |
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| Year of publication | 2013 |
| Type | Conference abstract |
| MU Faculty or unit | |
| Citation | |
| Description | Novel method of control of reactive magnetron sputtering process is presented. To control reactive magnetron sputtering process the process pressure is regulated by the flow of the reactive gas (nitrogen). Oscillations of the flow of the reactive gas are determined and used as feedback to find the right overall pressure, where stoichiometric coating is deposited. To see typical process behavior, see fig. 1. Proposed method of control was used for deposition of several coatings (TiN, AlTiN, AlCrN, CrTiN, …) on industrial scale central rotating unbalanced magnetron. To achieve superior adhesion of these layers, novel cleaning method called LGD was used. These coatings were used in industrial applications. Applications results in comparison with market standard coatings will be presented along with other measurements of deposited layers (EDX, SIMS, SEM, … ). |
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